电子电路互连与封装的定义和术语

IPC-TM-650TestMethodsManual

试验方法手册

IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies

电气与电子组装件锡焊要求

IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment1

J-STD-001辅助手册及指南及修改说明1

IPC-A-610DAcceptabilityofElectronicAssemblies

印制板组装件验收条件

IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparison

IPC-610手册和指南(包括IPC-A-610B和C的对比)

IPC-EA-100-KElectronicAssemblyReferenceSet

电子组装成套手册，包括：IPC/EIAJ-STD-001C，IPC-HDBK-001，IPC-A-610C。

IPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssemblies

电缆和引线贴装的要求和验收

IPC/EIAJ-STD-012ImplementationofFlipChipandChipScaleTechnology

倒装芯片及芯片级封装技术的应用

IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation

芯片直装技术实施导则

IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChipApplications

倒装芯片用半导体设计标准

J-STD-027MechanicalOutlineStandardforFlipChipandChipSizeConfigurations

FC（倒装片）和CSP(芯片级封装)的外形轮廓标准

IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps

倒装芯片及芯片级凸块结构的性能标准

J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology

球栅阵列(BGA)及其它高密度封装技术的应用

IPC-7095DesignandAssemblyProcessImplementationforBGAs

球栅阵列的设计与组装过程的实施

IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBalls

BGA球形凸点的标准规范

IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilization

多芯片组件技术应用导则

IPC-M-108CleaningGuidesandHandbookManual

清洗导则和手册

IPC-5701UsersGuideforCleanlinessofUnpopulatedPrintedBoards

非密集型印制板清洁应用导则

IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs

电路板离子洁净度测量：它告诉我们什么？

IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies

印制板及组装件清洗导则

IPC-SC-60APostSolderSolventCleaningHandbook

锡焊后溶剂清洗手册

IPC-SA-61APostSolderSemi-aqueousCleaningHandbook

锡焊后半水溶剂清洗手册

IPC-AC-62AAqueousPostSolderCleaningHandbook

锡焊后水溶液清洗手册

IPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailuresinPrintedCircuitAssemblies

电化学迁移：印制电路组件的电气诱发故障

IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3--LowSolids,FluxesandPastesProcessedinAmbientAir

IPC第3阶段非清洗助焊剂研究

IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting

深入离子洁净度测试

IPC-9201SurfaceInsulationResistanceHandbook

表面绝缘电阻手册

IPC-TP-104-KCleaning&CleanlinessTestProgram,Phase3WaterSolubleFluxes,

Part1&Part2第3阶段水溶性助焊剂清洗，第一和第二部分

IPC-M-109ComponentHandlingManual

元件处理手册

IPC/JEDECJ-STD-020CMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices